Ngemuva kokuthi kufakwe izingxenye ze-SMT & QC'ed, isinyathelo esilandelayo ukuhambisa amabhodi ekukhiqizweni kwe-DIP ukuqedela ngomhlangano wengxenye yomgodi.

I-DIP = iphakethe elikabili eliku-inthanethi, libizwa nge-DIP, kuyindlela ehlanganisiwe yokupakisha yesifunda. Ukuma kwesekethe elihlanganisiwe kungunxande, futhi kunemigqa emibili yezikhonkwane zensimbi ezihambisanayo ezinhlangothini zombili ze-IC, ezibizwa ngokuthi izihloko zephini. Izingxenye zephakeji le-DIP zingathengiswa ku-plated ngezimbobo zebhodi lesifunda eliphrintiwe noma zifakwe kusokhethi le-DIP.

1. Izici zephakheji ye-DIP:

1. Ilungele ukugoqa ngembobo kwi-PCB

2.Ukuhamba ngomgwaqo okulula kwe-PCB kune-TO package

3. Ukusebenza okulula

DIP1

2. Ukusetshenziswa kwe-DIP:

I-CPU ka-4004/8008/8086/8088, i-diode, ukumelana ne-capacitor

3. Umsebenzi we-DIP:

I-chip esebenzisa le ndlela yokupakisha inemigqa emibili yezikhonkwane, ezingathengiswa ngqo kusokhethi ye-chip enesakhiwo se-DIP noma ifakwe ngenani elifanayo lezimbobo ze-solder. Isici sayo ukuthi ingafinyelela kalula ekushiseni okumbobo yamabhodi e-PCB futhi inokuhambisana okuhle nebhodi lomama.

DIP2

4. Umehluko phakathi kwe-SMT ne-DIP

I-SMT ngokuvamile ifaka izinto ezingenawo umthofu noma ezihola phambili. Ukunamathisela kweSolder kudinga ukuphrintwa ebhodini lesifunda, bese kufakwa i-chip mounter, bese idivaysi ilungiswa ngokufaka kabusha okokufaka kabusha.

I-DIP soldering iyinsimbi ehlanganiswe ngqo ephaketheni, elungiswa nge-wave soldering noma nge-soldering yesandla.

5. Umehluko phakathi kwe-DIP ne-SIP

I-DIP: Imigqa emibili yemikhondo isuka ohlangothini lwedivayisi futhi imi kuma-engeli angakwesokudla endizeni ehambelana nomzimba wengxenye.

I-SIP: Umugqa wemikhondo eqondile noma izikhonkwane zivela eceleni kocingo.

DIP3
DIP4