Amabhodi Wokulawula we-MCU

I-MCU njengengxenye eyinhloko ye-IOT, yathuthukiswa ngokushesha eminyakeni yamuva.

Ibhodi yokulawula ye-MCU, enegama eligcwele le-Micro Controller Unit, ingahlanganisa i-chip esuselwe kwisilawuli esincane, ezinye izinto ze-elekthronikhi ne-PCB ehlanganisiwe ukulawula amasekethe angaphandle. Ngokuya ngezici zokukala nokulawulwa kwezinto zezimboni, imvelo, kanye ne-interface, ibhodi lokulawula le-MCU liqonde emsebenzini wokwenza imali, ukwenza ngcono ukuthembeka emvelweni yezimboni, nokwakha isikhombimsebenzisi esibonakalayo sohlelo lwekhompiyutha yohlelo ngokuguquguqukayo nangokuzikhandla .

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Ukusetshenziswa kwamabhodi wokulawula we-MCU:

Imvamisa isetshenziswa kwezinye izilawuli ezilula zezimboni, njengokulinganisa nokulawula uhlelo, imitha ehlakaniphile, imikhiqizo ye-mechatronics, isikhombimsebenzisi esibonakalayo, njll. Futhi i-MCU nayo ingasetshenziswa emikhiqizweni ehlakaniphile yomphakathi, njengemishini yasendlini, amathoyizi, induduzo yemidlalo, i-audiovisual imishini, izikali zikagesi, amarejista wemali, okokusebenza kwehhovisi, okokusebenza kwasekhishini, njll. Ukwethulwa kwe-MCU akugcini nje ngokuthuthukisa kakhulu imisebenzi yemikhiqizo, kuthuthukisa ukusebenza, kepha futhi kufinyelela nomphumela wokuSebenzisa.

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Umgomo wamabhodi wokulawula we-MCU:

Konga kakhulu ukusebenzisa ulimi lwe-C noma ezinye izilimi zokulawula ukubhala izinqubo zokwenza isenzo ukufeza inhloso enkulu yokulawulwa kwezimboni.

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Amandla we-MCU:

Izinto Eziyisisekelo: FR-4

Ubukhulu beCopper: 17.5um-175um (0.5oz-5oz)

Ubukhulu beBhodi: 0.21mm ~ 7.0mm

Ubuncane. Hole Usayizi: 0.10mm

Ubuncane. Ulayini Ububanzi: 3mil

Ubuncane. Isikhala Somugqa: 3 Mil (0.075 Mm)

Ukuqedelwa Kwaphezulu: I-HASL

Izinhla: 1 ~ 32 izingqimba

Ukubekezelelana kweHole: PTH: ± 0.076mm, NTPH: ± 0.05mm

Umbala wesolder Solder: Okuluhlaza / oMhlophe / omnyama / oBomvu / Ophuzi / oBlue

Umbala weSilkscreen: Mhlophe / Mnyama / Mphuzi / Luhlaza okwesibhakabhaka

Izinga eliyisethenjwa: IPC-A-600G Isigaba 2, Isigaba 3

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Umehluko phakathi kwe-MCU ne-PLD:

(1) I-MCU ilawula amadivayisi wangaphandle ukuthi asebenze ngokushintsha izinga letheku le-I / O ngohlelo; I-PLD ukuguqula ukwakheka kwangaphakathi kwe-chip ngohlelo.

(2) I-MCU iyi-chip, kepha ayinakusetshenziswa ngqo; I-PLC ine-interface eyenziwe ngomumo, kulula kakhulu futhi inokwethenjelwa ukuyisebenzisa ngqo endaweni yezimboni, bese uxhuma kusixhumi esibonakalayo somshini womuntu ukulawula okuqondile.

(3) chip ye-MCU ishibhile, futhi isetshenziselwa ukulawula okuzenzakalelayo kwemikhiqizo ye-batch embonini yokukhiqiza; I-PLC ilungele ukulawula okuzenzakalelayo kwezimboni.

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