micro chip scanning

I-Fumax Tech inikela ngamabhodi wesekethe wokuphrinta wekhwalithi ephezulu (i-PCB) kufaka phakathi i-multi-layer PCB (ibhodi lesifunda eliphrintiwe), i-HDI esezingeni eliphakeme (isixhumi esiphakathi esihlanganisayo), i-PCB engalawuleki kanye ne-PCB eqinile eguquguqukayo… njll.

Njengokwesisekelo, i-Fumax iyakuqonda ukubaluleka kwekhwalithi ethembekile ye-PCB. Sitshala imali ekuthengeni okungcono kakhulu nasethimbeni elinethalente ukukhiqiza amabhodi asezingeni eliphakeme.

Izigaba ezijwayelekile ze-PCB zingezansi.

Ngesandla Esiqinile PCB

Nezimo & Ngesandla Esiqinile Flex PCBs

I-HDI PCB

Imvamisa High PCB

I-PCB ephezulu ye-TG

I-PCB ye-LED

Metal core PCB

Okujiyile Cooper PCB

Aluminium PCB

 

Amandla ethu okukhiqiza akhonjiswa eshadini elingezansi.

Thayipha

Amandla

Ububanzi

Ama-multilayers (4-28), i-HDI (4-20) i-Flex, i-Flex eqinile

Uhlangothi Olabili

I-CEM-3, FR-4, i-Rogers RO4233, i-Bergquist Thermal Clad 4mil – 126mil (0.1mm-3.2mm)

Ama-multilayers

4-28 izingqimba, ibhodi ukujiya 8mil-126mil (0.2mm-3.2mm)

Ngcwatshwe / Blind Via

4-20 izingqimba, ibhodi ukujiya 10mil-126mil (0.25mm-3.2mm)

I-HDI

1 + N + 1、2 + N + 2、3 + N + 3 、 Noma yimuphi ungqimba

Flex & Ngesandla Esiqinile-Flex PCB

1-8layers Flex PCB, 2-12layers Ngesandla Esiqinile-flex PCB HDI + Ngesandla Esiqinile-flex PCB

Laminate

 

Uhlobo Soldermask (LPI)

UTaiyo 、 Goo's im Probimer FPC .....

I-Soldermask ephathekayo

 

Uyinki wekhabhoni

 

HASL / Lead Mahhala HASL

Ubukhulu: 0.5-40um

I-OSP

 

I-ENIG (Ni-Au)

 

I-Ni-Au eboshelwa nge-Electro

 

I-Electro-nickel palladium Ni-Au

I-Au: 0.015-0.075um Pd 0.02-0.075um Ni: 2-6umm

Electro. Igolide Elinzima

 

Ithini elijiyile

 

Amandla

Ukukhiqizwa kweMisa

I-Min Mechanical Drill Hole

0.20mm

Ubuncane. Laser Drill Hole

4mil (0.100mm)

Ububanzi Bomugqa / Isikhala

2mil / 2mil

UMax. Usayizi wePhaneli

I-21.5 "X 24.5" (546mm X 622mm)

Ububanzi Bomugqa / Ukubekezelela Isikhala

Ukumbozwa okungekho kwe-electro: +/- 5um, ukumbozwa kwe-Electro: +/- 10um

PTH Hole Ukubekezelelana

+/- 0.002inch (0.050mm)

NPTH Hole Ukubekezelelana

+/- 0.002inch (0.050mm)

Hole Indawo Tolerance

+/- 0.002inch (0.050mm)

I-Hole to Edge Tolerance

+/- 0.004inch (0.100mm)

I-Edge to Edge Tolerance

+/- 0.004inch (0.100mm)

Layer ukuze Layer Ukubekezelelana

+/- 0.003inch (0.075mm)

Ukubekezelelana kwe-Impedance

+/- 10%

I-Warpage%

Ubukhulu≤0.5%

Ubuchwepheshe (Umkhiqizo we-HDI)

INTO

Ukukhiqizwa

I-Laser Via Drill / Pad

0.125 / 0.30 、 0.125 / 0.38

I-Blind Via Drill / Pad

0.25 / 0.50

Ububanzi Bomugqa / Isikhala

0.10 / 0.10

Ukwakheka kweHole

I-CO2 Laser Direct Drill

Yakha Izinto

I-FR4 LDP (LDD); I-RCC 50 ~ 100 micron

Ubukhulu beCu kuHole Wall

I-Hole Blind: 10um (iminithi)

Ukubukeka kwesilinganiselo

0.8: 1

Ubuchwepheshe (i-PCB eguqukayo)

Iphrojekthi 

Amandla

Roll ukugoqa (uhlangothi olulodwa)

YEBO

Qengqela ukugoqa (kabili)

Cha

Ivolumu yokugoqa ububanzi bezinto ezibonakalayo mm 

250

Usayizi wokukhiqiza omncane mm 

250x250 

Usayizi omkhulu wokukhiqiza mm 

500x500 

I-SMT Assembly patch (Yebo / Cha)

YEBO

Amandla we-Air Gap (Yebo / Cha)

YEBO

Ukukhiqizwa kwepuleti elibophezelayo eliqinile nelithambile (Yebo / Cha)

YEBO

Izendlalelo ezinkulu (Zilukhuni)

10

Isendlalelo eside kunazo zonke (Ipuleti elithambile)

6

Isayensi Yezinto 

 

PI

YEBO

PET

YEBO

Ithusi Electrolytic

YEBO

Ucwecwe lwe-Anneal Copper ogoqiwe

YEBO

PI

 

Ukumboza ukubekezelelana kokuqondiswa kwefilimu mm

± 0.1 

Ubuncane bokumboza ifilimu mm

0.175

Ukuqinisa 

 

PI

YEBO

FR-4

YEBO

SUS

YEBO

I-EMI SHIELDING

 

Isiliva Ink

YEBO

Isiliva Film

YEBO