Soler Namathisela Ukuhlolwa

Ukukhiqizwa kweFumax SMT kufake umshini we-SPI othomathikhi ukuhlola ikhwalithi yokuphrinta ye-solder, ukuqinisekisa ikhwalithi engcono kakhulu ye-soldering.

SPI1

I-SPI, eyaziwa njengokuhlolwa kokunamathisela kwe-solder, idivayisi yokuhlola ye-SMT esebenzisa umgomo we-optics ukubala ukuphakama kokunamathisela kwe-solder okuphrintwe ku-PCB ngunxantathu. Kungukuhlolwa kwekhwalithi yokuphrinta kwe-solder kanye nokuqinisekiswa nokulawulwa kwezinqubo zokuphrinta.

SPI2

1. Umsebenzi we-SPI:

Thola ukushiyeka kwekhwalithi yokuphrinta ngesikhathi.

I-SPI ingatshela abasebenzisi ngokunembile ukuthi imaphi ama-solder paste ama-prints amahle nokuthi yini angalungile, futhi inikezela ngamaphoyinti okuluhlobo luni lwesici.

I-SPI ukuthola uchungechunge lwe-solder unamathisele ukuthola ukuthambekela kwekhwalithi, bese uthola izici ezingadala lo mkhuba ngaphambi kokuba ikhwalithi yeqe ibanga, ngokwesibonelo, amapharamitha wokulawula womshini wokuphrinta, izici zabantu, izinto zokushintsha zokunamathisela ze-solder, njll. Ngemuva kwalokho singazilungisa ngesikhathi ukuze silawule ukusabalala okuqhubekayo komkhuba.

2. Yini okufanele itholwe:

Ukuphakama, ivolumu, indawo, ukungalungiswa kahle kwesimo, ukusabalalisa, ukulahleka, ukwehlukana, ukuphambuka kokuphakama (ithiphu)

SPI3

3. Umehluko phakathi kwe-SPI ne-AOI:

(1) Ukulandela ukuphrinta kokunamathisela kwe-solder nangaphambi komshini we-SMT, i-SPI isetshenziselwa ukufeza ukuhlolwa kwekhwalithi yokuphrinta kwe-solder nokuqinisekiswa nokulawulwa kwamapharamitha wenqubo yokuphrinta, ngomshini wokuhlola wokunamathisela we-solder (onedivayisi ye-laser ekwazi ukubona ukushuba unamathisela i-solder).

(2) Ukulandela umshini we-SMT, i-AOI ukuhlolwa kokubekwa kwengxenye (ngaphambi kokufakwa kabusha kwe-soldering) kanye nokuhlolwa kwamalunga we-solder (ngemuva kokufaka kabusha i-soldering).