Indlu yakwaFumax SMT ifakele umshini weX-Ray ukuhlola izingxenye ze-soldering ezifana neBGA, QFN… njll

I-X-ray isebenzisa amandla amancane e-X-ray ukuthola izinto ngokushesha ngaphandle kokuzilimaza.

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1. Ububanzi besicelo:

IC, BGA, PCB / PCBA, ebusweni ukukhweza inqubo solderability ukuhlolwa, njll

2. Okujwayelekile

I-IPC-A-610, GJB 548B

3. Umsebenzi we-X-Ray:

Isebenzisa imigomo yomthelela wamandla aphezulu ukukhiqiza ukungena kwe-X-Ray ukuhlola ikhwalithi yangaphakathi yokwakheka kwezinto ze-elekthronikhi, imikhiqizo yokupakisha ye-semiconductor, kanye nekhwalithi yezinhlobo ezahlukahlukene zamalunga we-SMT solder.

4. Yini okufanele itholwe:

Izinto zensimbi nezingxenye, izinto zepulasitiki nezingxenye, izinto ze-elekthronikhi, izinto ze-elekthronikhi, izingxenye ze-LED nokunye ukuqhekeka kwangaphakathi, ukutholwa kwento engaziwa, i-BGA, ibhodi lesifunda nokunye ukuhlaziywa kwangaphakathi kokufuduswa; khomba i-welding engenalutho, i-welding ebonakalayo namanye amaphutha we-BGA welding, amasistimu we-microelectronic kanye nezinto ezihlanganisiwe, izintambo, okufakiwe, ukuhlaziywa kwangaphakathi kwezingxenye zepulasitiki.

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5. Ukubaluleka kwe-X-Ray:

I-X-RAY technology technology ilethe izinguquko ezintsha ezindleleni zokuhlola ukukhiqizwa kwe-SMT. Kungashiwo ukuthi i-X-Ray njengamanje iyindlela ethandwa kakhulu ngabakhiqizi abazimisele ukuqhubeka nokwenza ngcono izinga lokukhiqiza le-SMT, bathuthukise ikhwalithi yokukhiqiza, futhi bazothola ukwehluleka kwemihlangano yesifunda ngesikhathi njengokuthuthuka. Ngomkhuba wokuthuthuka phakathi ne-SMT, ezinye izindlela zokuthola iphutha lomhlangano kunzima ukuzisebenzisa ngenxa yemikhawulo yazo. Imishini yokuthola othomathikhi ye-X-RAY izoba yinto entsha ekugxilwe kuyo yemishini yokukhiqiza ye-SMT futhi idlale indima ebandayo emkhakheni wokukhiqiza we-SMT.

6. Inzuzo ye-X-Ray:

(1) Ingakwazi ukuhlola ukumbozwa okungu-97% kwenqubo yokukhubazeka, kufakiwe kepha kungagcini lapho: ukunamathisela okungamanga, ukubopha ibhuloho, itshe lesikhumbuzo, i-solder enganele, ama-blowholes, izinto ezingekho, njll. Ikakhulukazi, i-X-RAY ingabuye ihlole amadivayisi ahlanganisiwe e-solder afihlekile njenge-BGA ne-CSP. Ngaphezu kwalokho, ku-SMT X-Ray ingahlola iso kanye nezindawo ezingenakuhlolwa ngokuhlolwa okuku-inthanethi. Isibonelo, lapho i-PCBA yahlulelwa njengeyiphutha futhi isolwa ukuthi ungqimba lwangaphakathi lwe-PCB luphukile, i-X-RAY ingayihlola ngokushesha.

(2) Isikhathi sokulungiselela ukuhlolwa sincishiswe kakhulu.

(3) Kungabonakala iziphambeko ezingenakutholwa ngokwethembeka ngezinye izindlela zokuhlola, ezinjengokushisela okungamanga, izimbobo zomoya, ukubumba okungalungile, njll.

(4) Kudingeka ukuhlolwa kube kanye kuphela emabhodini anezinhlangothi ezimbili nangamatshe amaningi kanye (ngomsebenzi wokubeka)

(5) Imininingwane yokulinganisa efanele ingahlinzekwa ukuhlola inqubo yokukhiqiza ku-SMT. Njengokushuba kokunamathisela kwe-solder, inani le-solder ngaphansi kwejoyini le-solder, njll.